Samsung To Expand Chip Packaging Facilities For HBM

Seoul: Samsung Electronics will expand its semiconductor package facilities in South Chungcheong Province to boost production of high bandwidth memory (HBM) chips, company officials said on Tuesday.

Under a memorandum of understanding with the provincial government, Samsung Electronics will convert an underused liquid crystal display plant owned by Samsung Display Co. in Cheonan, some 85 kms south of Seoul, into a semiconductor fabrication plant, according to the officials.

The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are in high demand due to their essential role in AI computing, reports Yonhap news agency.