CDIL to add assembly lines, boost capacity by 100 mn units
It will add packaging lines in India through MeitY’s Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors
image for illustrative purpose
CDIL has established an advanced high reliability (HiRel) and testing laboratory at Mohali in addition to its NABL Accredited facility in Delhi
New Delhi: Semiconductor chips and components manufacturer CDIL on Tuesday announced that it will be adding new semiconductor packaging lines in India.
This addition of semiconductor packaging lines by CDIL (Continental Device India Pvt. Ltd.) will be done via the Central government and MeitY’s (Ministry of Electronics and Information Technology) Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) in India. With the new lines, CDIL aims to increase its annual capacity by 100 million units in India.
The company initiated the first phase of this production with a surface mount packaging line of 50 million devices that will be inaugurated on September 28 by Rajeev Chandrasekhar, Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship.
